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B43082A1157M

B43082A1157M

B43082A1157M

TDK Electronics Inc.

Cap Aluminum Lytic 150uF 160V 20% (16 X 31.5mm) Radial 7.5mm 1300mA 5000h 105C Bulk

SOT-23

B43082A1157M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Through Hole
Package / Case Radial, Can
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
PackagingBulk
Series B43082
Size / Dimension 0.630Dia 16.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 160V
Capacitance 150μF
Packing Method AMMO PACK; TAPE
Operating Temperature (Max) 105°C
Operating Temperature (Min) -40°C
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Lead Spacing0.295 7.50mm
Rated (DC) Voltage (URdc) 160V
Lifetime @ Temp 5000 Hrs @ 105°C
Leakage Current 0.505mA
Polarization Polar
Tan Delta 0.15
Ripple Current @ High Frequency 1.3A @ 100kHz
Height Seated (Max) 1.319 33.50mm
RoHS StatusROHS3 Compliant
In-Stock:4318 items

About B43082A1157M

The B43082A1157M from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Aluminum Lytic 150uF 160V 20% (16 X 31.5mm) Radial 7.5mm 1300mA 5000h 105C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B43082A1157M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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