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B41896C6277M

B41896C6277M

B41896C6277M

TDK Electronics Inc.

Cap Aluminum Lytic 270uF 50V 20% (12.5 X 20mm) Radial 5mm 0.468 Ohm 1820mA 7000h 125C Bulk

SOT-23

B41896C6277M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-55°C~125°C
PackagingBulk
Series B41896
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature125°C
Min Operating Temperature -55°C
Applications Automotive
Voltage - Rated 50V
Capacitance 270μF
Lead Pitch 5.0038mm
ESR (Equivalent Series Resistance) 468mOhm @ 120Hz
Polarity Polar
Lead Spacing0.197 5.00mm
Lead Diameter 600 μm
Lifetime @ Temp 7000 Hrs @ 125°C
Ripple Current1.82A
Polarization Polar
Life (Hours) 7000 hours
Impedance55mOhms
Ripple Current @ High Frequency 1.82A @ 100kHz
Height Seated (Max) 0.866 22.00mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:2086 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About B41896C6277M

The B41896C6277M from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Aluminum Lytic 270uF 50V 20% (12.5 X 20mm) Radial 5mm 0.468 Ohm 1820mA 7000h 125C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B41896C6277M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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