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B41858C3278M

B41858C3278M

B41858C3278M

TDK Electronics Inc.

CAP ALUM 2700UF 20% 10V RADIAL

SOT-23

B41858C3278M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 26 Weeks
Mounting Type Through Hole
Package / Case Radial, Can
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-55°C~105°C
PackagingBulk
Series B41858
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications Automotive
Voltage - Rated 10V
Capacitance 2700μF
Packing Method BLISTER PACK
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 41mOhm @ 10kHz
Lead Spacing0.197 5.00mm
Rated (DC) Voltage (URdc) 10V
Lifetime @ Temp 5000 Hrs @ 105°C
Leakage Current 0.27mA
Polarization Polar
Tan Delta 0.23
Impedance34mOhm
Ripple Current @ High Frequency 2.028A @ 100kHz
Height Seated (Max) 1.063 27.00mm
RoHS StatusROHS3 Compliant
In-Stock:1958 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About B41858C3278M

The B41858C3278M from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 2700UF 20% 10V RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B41858C3278M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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