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B37871K5122J060

B37871K5122J060

B37871K5122J060

TDK Electronics Inc.

CAP CER 1200PF 50V NP0 1206

SOT-23

B37871K5122J060 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount, MLCC
Package / Case 1206 (3216 Metric)
Surface MountYES
Terminal Shape WRAPAROUND
Dielectric MaterialCERAMIC
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Series B37871K
Size / Dimension 0.126Lx0.063W 3.20mmx1.60mm
Tolerance ±5%
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientC0G NP0
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Applications Automotive
Voltage - Rated 50V
HTS Code8532.24.00.20
Capacitance 1200pF
Packing Method TR, CARDBOARD, 7 INCH
Reach Compliance Code unknown
Capacitor Type CERAMIC CAPACITOR
Temperature Characteristics Code C0G
Multilayer Yes
Rated (DC) Voltage (URdc) 50V
Custom Capabilities Alternative Capacitance Available On Req
Height 0.8mm
Length 3.2mm
Width 1.6mm
Thickness (Max) 0.035 0.90mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:4998 items

About B37871K5122J060

The B37871K5122J060 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 1200PF 50V NP0 1206.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B37871K5122J060, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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