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ZCAT3035-1330

ZCAT3035-1330

ZCAT3035-1330

TDK Corporation

FERRITE CORE 150 OHM HINGED 13MM

SOT-23

ZCAT3035-1330 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status PRODUCTION (Last Updated: 1 month ago)
Mount Chassis Mount
Mounting Type Chassis Mount
Package / Case 100
Material 30
Housing Material Plastic
Shape Round
PackagingBulk
Published 2001
Series ZCAT
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Round
Max Operating Temperature85°C
Min Operating Temperature -40°C
Color Grey
Frequency 500MHz
Test Frequency50MHz
Impedance80Ohm
Wire/Cable Diameter 13 mm
Max Frequency 500MHz
Design Hinged (Snap On)
Impedance @ Frequency 150Ohm @ 100MHz~500MHz
Outside Diameter30 mm
Outer Dimension 1.181 Dia (30.00mm)
Diameter 30mm
Length 1.535 39.00mm
Diameter - Inside 13.1 mm
Diameter - Inner 0.512 Dia (13.00mm)
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1387 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.71000$5.71
10$4.89800$48.98
25$3.77560$94.39
50$3.67400$183.7
100$3.26560$326.56
250$3.06152$765.38
500$2.85740$1428.7

About ZCAT3035-1330

The ZCAT3035-1330 from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features FERRITE CORE 150 OHM HINGED 13MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ZCAT3035-1330, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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