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TLA-6T776F

TLA-6T776F

TLA-6T776F

TDK Corporation

CONN MAGJACK 1PORT 100 BASE-TX

SOT-23

TLA-6T776F Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case 100
Operating Temperature-40°C~85°C
PackagingTray
Published 2012
Series TLA
Feature Board Lock
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type RJ45
Max Operating Temperature85°C
Min Operating Temperature -40°C
Applications 10/100 Base-TX, AutoMDIX
Number of Rows 1
Orientation 90° Angle (Right)
Shielding Shielded, EMI Finger
Current Rating8mA
Inductance 200 μH
Number of Ports1
Direction Up
LED ColorDoes Not Contain LED
Tab Direction Up
Number of Cores per Jack 4
Length 13.85mm
Width 21.45mm
Height Above Board 0.545 13.84mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4545 items

About TLA-6T776F

The TLA-6T776F from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN MAGJACK 1PORT 100 BASE-TX.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TLA-6T776F, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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