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TFM201610ALMAR33MTAA

TFM201610ALMAR33MTAA

TFM201610ALMAR33MTAA

TDK Corporation

TFM201610ALMAR33MTAA datasheet pdf and Fixed Inductors product details from TDK Corporation stock available on our website

SOT-23

TFM201610ALMAR33MTAA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 0806 (2016 Metric)
Material - Core Metal
Operating Temperature-55°C~150°C
PackagingTape & Reel (TR)
Series TFM-ALMA
Size / Dimension 0.079Lx0.063W 2.00mmx1.60mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Thin Film
Current Rating (Amps) 4.3A
Shielding Shielded
Inductance 330nH
DC Resistance (DCR) 31mOhm Max
Inductance Frequency - Test 1MHz
Current - Saturation 5.2A
Height Seated (Max) 0.039 1.00mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:9090 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.528965$0.528965
10$0.499024$4.99024
100$0.470777$47.0777
500$0.444129$222.0645
1000$0.418990$418.99

About TFM201610ALMAR33MTAA

The TFM201610ALMAR33MTAA from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features TFM201610ALMAR33MTAA datasheet pdf and Fixed Inductors product details from TDK Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TFM201610ALMAR33MTAA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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