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NLC453232T-3R3K

NLC453232T-3R3K

NLC453232T-3R3K

TDK Corporation

NLC453232T-3R3K datasheet pdf and Fixed Inductors product details from TDK Corporation stock available on our website

SOT-23

NLC453232T-3R3K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1812 (4532 Metric)
Material - Core Ferrite
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Series NLC
Published 2003
Size / Dimension 0.177Lx0.126W 4.50mmx3.20mm
Tolerance ±10%
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Shielding Unshielded
Reach Compliance Code unknown
Current Rating750mA
Case Code (Metric) 4532
Case Code (Imperial) 1812
Inductance 3.3μH
Test Frequency7.96MHz
DC Resistance (DCR) 220mOhm Max
Frequency - Self Resonant 45MHz
Q @ Freq 10 @ 7.96MHz
Inductance Frequency - Test 7.96MHz
Height 3.2004mm
Height Seated (Max) 0.134 3.40mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:3233 items

About NLC453232T-3R3K

The NLC453232T-3R3K from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features NLC453232T-3R3K datasheet pdf and Fixed Inductors product details from TDK Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the NLC453232T-3R3K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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