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MLP1608VR47DT0S1

MLP1608VR47DT0S1

MLP1608VR47DT0S1

TDK Corporation

FIXED IND 470NH 800MA 220 MOHM

SOT-23

MLP1608VR47DT0S1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status PRODUCTION (Last Updated: 2 months ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0603 (1608 Metric)
Material - Core Ferrite
Operating Temperature-40°C~125°C
PackagingCut Tape (CT)
Published 2014
Series MLP
Size / Dimension 0.063Lx0.031W 1.60mmx0.80mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Multilayer
HTS Code8504.50.80.00
Shielding Shielded
Current Rating800mA
Case Code (Metric) 1608
Case Code (Imperial) 0603
Inductance 470nH
Test Frequency2MHz
DC Resistance (DCR) 286mOhm Max
Inductance Frequency - Test 2MHz
Height Seated (Max) 0.030 0.75mm
RoHS StatusROHS3 Compliant
In-Stock:24274 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.057706$0.057706
500$0.042430$21.215
1000$0.035359$35.359
2000$0.032440$64.88
5000$0.030317$151.585
10000$0.028202$282.02
15000$0.027275$409.125
50000$0.026818$1340.9

About MLP1608VR47DT0S1

The MLP1608VR47DT0S1 from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 470NH 800MA 220 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MLP1608VR47DT0S1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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