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MLG1608B3N9STD25

MLG1608B3N9STD25

MLG1608B3N9STD25

TDK Corporation

FIXED IND 3.9NH 600MA 140 MOHM

SOT-23

MLG1608B3N9STD25 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status OBSOLETE (Last Updated: 2 months ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0603 (1608 Metric)
Weight 3.997283mg
Material - Core Ceramic, Non-Magnetic
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2011
Series MLG
Size / Dimension 0.063Lx0.031W 1.60mmx0.80mm
Tolerance ±0.3nH
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
ECCN Code EAR99
Type Multilayer
HTS Code8504.50.80.00
Shielding Unshielded
Current Rating600mA
Case Code (Metric) 1608
Case Code (Imperial) 0603
Inductance 3.9nH
Test Frequency100MHz
DC Resistance (DCR) 140mOhm Max
Max DC Current 600mA
Frequency - Self Resonant 6GHz
Q @ Freq 10 @ 100MHz
Q Factor 10
Height 800μm
Height Seated (Max) 0.037 0.95mm
RoHS StatusRoHS Compliant
Ratings AEC-Q200
In-Stock:4999 items

About MLG1608B3N9STD25

The MLG1608B3N9STD25 from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 3.9NH 600MA 140 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MLG1608B3N9STD25, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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