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MLF2012A3R3MT

MLF2012A3R3MT

MLF2012A3R3MT

TDK Corporation

FIXED IND 3.3UH 50MA 600 MOHM

SOT-23

MLF2012A3R3MT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 0805 (2012 Metric)
Surface MountYES
Terminal Shape WRAPAROUND
Material - Core Ferrite
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Published 2015
Series MLF
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±20%
Pbfree Code yes
Part StatusNot For New Designs
Number of Terminations 2
ECCN Code EAR99
Type Multilayer
HTS Code8504.50.80.00
Current Rating (Amps) 50mA
Shielding Shielded
Number of Functions 1
Construction Chip
Inductance 3.3μH
Test Frequency10MHz
DC Resistance (DCR) 600mOhm
Frequency - Self Resonant 60MHz
Inductor Application RF INDUCTOR
Terminal Placement DUAL ENDED
Q @ Freq 45 @ 10MHz
Quality Factor-Min (at L-nom) 45
Inductance Frequency - Test 10MHz
Rated Current-Max 0.05A
Inductance Tolerance 20%
Height 1.25mm
Height Seated (Max) 0.057 1.45mm
RoHS StatusROHS3 Compliant
In-Stock:122574 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About MLF2012A3R3MT

The MLF2012A3R3MT from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 3.3UH 50MA 600 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MLF2012A3R3MT, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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