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MEA2010LD170T001

MEA2010LD170T001

MEA2010LD170T001

TDK Corporation

MEA2010LD170T001 datasheet pdf and EMI/RFI Filters (LC, RC Networks) product details from TDK Corporation stock available on our website

SOT-23

MEA2010LD170T001 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 0804 (2010 Metric), Array, 10 PC Pad
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Published 2013
Series MEA
Size / Dimension 0.079Lx0.039W 2.00mmx1.00mm
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Low Pass
Applications Data Lines for Mobile Devices
Voltage - Rated 6.3V
Technology LC
Case Code (Metric) 2010
Case Code (Imperial) 0804
Number of Channels 4
Current 100mA
ESD Protection No
Filter Order3rd
Values C = 17pF
Center / Cutoff Frequency 330MHz Cutoff
Height 0.024 0.60mm
RoHS StatusROHS3 Compliant
In-Stock:24875 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About MEA2010LD170T001

The MEA2010LD170T001 from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features MEA2010LD170T001 datasheet pdf and EMI/RFI Filters (LC, RC Networks) product details from TDK Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MEA2010LD170T001, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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