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FK11X5R1E475K

FK11X5R1E475K

FK11X5R1E475K

TDK Corporation

CAP CER 4.7UF 25V X5R RADIAL

SOT-23

FK11X5R1E475K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Dielectric MaterialCERAMIC
Operating Temperature-55°C~85°C
PackagingBulk
Published 2001
Series FK
Size / Dimension 0.217Lx0.157W 5.50mmx4.00mm
Tolerance ±10%
JESD-609 Code e2
Pbfree Code yes
Part StatusNot For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientX5R
Terminal Finish Tin/Copper (Sn/Cu)
Applications General Purpose
HTS Code8532.24.00.60
Capacitance 4.7μF
Voltage - Rated DC 25V
Packing Method AMMO PACK
Lead Pitch 2.5mm
Capacitor Type CERAMIC CAPACITOR
Lead Spacing0.098 2.50mm
Temperature Characteristics Code X5R
Multilayer Yes
Lead Diameter 500 μm
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
Height 4mm
Height Seated (Max) 0.276 7.00mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:17879 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About FK11X5R1E475K

The FK11X5R1E475K from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 4.7UF 25V X5R RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FK11X5R1E475K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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