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FA26C0G2J392JNU06

FA26C0G2J392JNU06

FA26C0G2J392JNU06

TDK Corporation

CAP CER 3900PF 630V C0G RADIAL

SOT-23

FA26C0G2J392JNU06 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Lifecycle Status PRODUCTION (Last Updated: 1 month ago)
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Dielectric MaterialCERAMIC
Operating Temperature-55°C~125°C
PackagingTape & Box (TB)
Published 2013
Series FA
Size / Dimension 0.217Lx0.138W 5.50mmx3.50mm
Tolerance ±5%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
Temperature CoefficientC0G NP0
Applications Automotive
Voltage - Rated 630V
Capacitance 3900pF
Packing Method AMMO PACK
Terminal Pitch5mm
Lead Pitch 5.0038mm
Capacitor Type CERAMIC CAPACITOR
Lead Spacing0.197 5.00mm
Temperature Characteristics Code C0G
Multilayer Yes
Rated (DC) Voltage (URdc) 630V
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
Height Seated (Max) 0.236 6.00mm
Length 5.5mm
Width 3.5mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:36728 items

Pricing & Ordering

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About FA26C0G2J392JNU06

The FA26C0G2J392JNU06 from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP CER 3900PF 630V C0G RADIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FA26C0G2J392JNU06, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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