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CS45SL2GA330JAVKA

CS45SL2GA330JAVKA

CS45SL2GA330JAVKA

TDK Corporation

AMMO PACK Mid voltage-Automotive

SOT-23

CS45SL2GA330JAVKA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status PRODUCTION (Last Updated: 1 month ago)
Mounting Type Through Hole
Package / Case Radial, Disc
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialCERAMIC
Operating Temperature-25°C~125°C
PackagingBulk
Published 2013
Series CS
Size / Dimension 0.276Dia 7.00mm
Tolerance ±5%
Feature High Voltage
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientSL
Applications Safety, Automotive
Voltage - Rated 300V
Additional FeatureRATED AC VOLTAGE (V): 300-440, SAFETY CLASS: X1/Y2, STANDARD: IEC60384-14
Capacitance 33pF
Packing Method AMMO PACK
Capacitor Type CERAMIC CAPACITOR
Lead Spacing0.295 7.50mm
Temperature Characteristics Code SL
Multilayer No
Lead Style Formed Leads - Kinked
Height Seated (Max) 0.433 11.00mm
Length 7mm
Width 7mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200, X1, Y2
In-Stock:21692 items

Pricing & Ordering

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About CS45SL2GA330JAVKA

The CS45SL2GA330JAVKA from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features AMMO PACK Mid voltage-Automotive.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CS45SL2GA330JAVKA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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