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CPL2510T3R3M

CPL2510T3R3M

CPL2510T3R3M

TDK Corporation

FIXED IND 3.3UH 700MA 270 MOHM

SOT-23

CPL2510T3R3M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status OBSOLETE (Last Updated: 2 months ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Nonstandard
Terminal Shape WRAPAROUND
Material - Core Ferrite
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-40°C~105°C
PackagingTape & Reel (TR)
Published 2001
Series CPL
Size / Dimension 0.098Lx0.059W 2.50mmx1.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Packing Method TR
Shielding YES
Number of Functions 1
Depth 1.7mm
Current Rating700mA
Case Code (Metric) 2515
Case Code (Imperial) 1006
Inductance 3.3μH
DC Resistance (DCR) 351mOhm Max
Max DC Current 700mA
Inductor Application POWER INDUCTOR
Terminal Placement DUAL ENDED
Special Feature DCR IS MEASURED AT +/-30% TOLERANCE
Height 1mm
Height Seated (Max) 0.039 1.00mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:3168 items

About CPL2510T3R3M

The CPL2510T3R3M from TDK Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 3.3UH 700MA 270 MOHM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CPL2510T3R3M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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