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TSDGLW

TSDGLW

TSDGLW

Taiwan Semiconductor Corporation

1A 400V ESD CAPABILITY RECTIFIER

SOT-23

TSDGLW Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case SOD-123W
Surface MountYES
Diode Element Material SILICON
PackagingTape & Reel (TR)
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code8541.10.00.80
Terminal Position DUAL
Terminal FormFLAT
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Reference Standard AEC-Q101
JESD-30 Code R-PDSO-F2
Operating Temperature (Max) 175°C
Number of Elements 1
Configuration SINGLE
Speed Standard Recovery >500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 1μA @ 400V
Operating Temperature - Junction -55°C~175°C
Output Current-Max 1A
Voltage - DC Reverse (Vr) (Max) 400V
Current - Average Rectified (Io) 1A
Rep Pk Reverse Voltage-Max 400V
Capacitance @ Vr, F 15pF @ 4V 1MHz
RoHS StatusROHS3 Compliant
In-Stock:14963 items

Pricing & Ordering

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About TSDGLW

The TSDGLW from Taiwan Semiconductor Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features 1A 400V ESD CAPABILITY RECTIFIER.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TSDGLW, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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