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SS14LSHRVG

SS14LSHRVG

SS14LSHRVG

Taiwan Semiconductor Corporation

DIODE SCHOTTKY 40V 1A SOD123HE

SOT-23

SS14LSHRVG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case SOD-123H
Surface MountYES
Diode Element Material SILICON
PackagingDigi-Reel®
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional FeatureLOW POWER LOSS
Terminal Position DUAL
Terminal FormFLAT
Reference Standard AEC-Q101
JESD-30 Code R-PDSO-F2
Operating Temperature (Max) 150°C
Number of Elements 1
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 400μA @ 40V
Voltage - Forward (Vf) (Max) @ If 550mV @ 1A
Case Connection CATHODE
Operating Temperature - Junction -55°C~150°C
Output Current-Max 1A
Voltage - DC Reverse (Vr) (Max) 40V
Current - Average Rectified (Io) 1A
Rep Pk Reverse Voltage-Max 40V
Capacitance @ Vr, F 80pF @ 4V 1MHz
RoHS StatusROHS3 Compliant
In-Stock:83315 items

Pricing & Ordering

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About SS14LSHRVG

The SS14LSHRVG from Taiwan Semiconductor Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE SCHOTTKY 40V 1A SOD123HE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SS14LSHRVG, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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