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LL5817 L0G

LL5817 L0G

LL5817 L0G

Taiwan Semiconductor Corporation

DIODE SCHOTTKY 20V 1A MELF

SOT-23

LL5817 L0G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Mounting Type Surface Mount
Package / Case DO-213AB, MELF
Surface MountYES
Diode Element Material SILICON
PackagingTape & Reel (TR)
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Position END
Terminal FormWRAP AROUND
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code O-LELF-R2
Operating Temperature (Max) 125°C
Number of Elements 1
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 500μA @ 20V
Voltage - Forward (Vf) (Max) @ If 750mV @ 3A
Case Connection ISOLATED
Operating Temperature - Junction -65°C~125°C
Output Current-Max 1A
Voltage - DC Reverse (Vr) (Max) 20V
Current - Average Rectified (Io) 1A
Rep Pk Reverse Voltage-Max 20V
Capacitance @ Vr, F 110pF @ 4V 1MHz
RoHS StatusROHS3 Compliant
In-Stock:40838 items

Pricing & Ordering

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About LL5817 L0G

The LL5817 L0G from Taiwan Semiconductor Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE SCHOTTKY 20V 1A MELF.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the LL5817 L0G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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