Welcome to Hotenda.com Online Store!

logo
userjoin
Home

BZV55B5V1L1

BZV55B5V1L1

BZV55B5V1L1

TAIWAN SEMICONDUCTOR CO LTD

BZV55B5V1L1 datasheet pdf and Unclassified product details from TAIWAN SEMICONDUCTOR CO LTD stock available on our website

SOT-23

BZV55B5V1L1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Surface MountYES
Diode Element Material SILICON
Number of Terminals 2
ECCN Code EAR99
Additional FeatureHIGH RELIABILITY
HTS Code8541.10.00.50
Terminal Position END
Terminal FormWRAP AROUND
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code O-LELF-R2
Qualification StatusNot Qualified
Operating Temperature (Max) 175°C
Operating Temperature (Min) -65°C
Number of Elements 1
Polarity UNIDIRECTIONAL
Configuration SINGLE
Power Dissipation-Max 0.5W
Diode Type ZENER DIODE
Case Connection ISOLATED
Reference Voltage5.1V
Voltage Tol-Max 2%
JEDEC-95 Code DO-213AC
Working Test Current 5mA
RoHS StatusRoHS Compliant
In-Stock:2486 items

About BZV55B5V1L1

The BZV55B5V1L1 from TAIWAN SEMICONDUCTOR CO LTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features BZV55B5V1L1 datasheet pdf and Unclassified product details from TAIWAN SEMICONDUCTOR CO LTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BZV55B5V1L1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

Get Subscriber

Enter Your Email Address, Get the Latest News