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COH-1706-200-20-1NT

COH-1706-200-20-1NT

COH-1706-200-20-1NT

Taica North America Corporation

THERMAL INTERFACE PAD, GAP PAD,

SOT-23

COH-1706-200-20-1NT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Gel
Shape Square
Series λGEL™ COH
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gel Pad, Sheet
Color Gray
Adhesive Tacky - One Side
Outline 200.00mm x 200.00mm
Thermal Conductivity3.8W/m-K
Thickness 0.0790 2.000mm
RoHS StatusRoHS Compliant
In-Stock:436 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$20.34000$20.34
10$19.21000$192.1
25$18.08000$452
50$16.95000$847.5
100$15.82000$1582
250$14.69000$3672.5
500$14.40750$7203.75

About COH-1706-200-20-1NT

The COH-1706-200-20-1NT from Taica North America Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERMAL INTERFACE PAD, GAP PAD,.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the COH-1706-200-20-1NT, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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