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TI900-105-27-0.12-1A

TI900-105-27-0.12-1A

TI900-105-27-0.12-1A

t-Global Technology

THERM PAD 105MMX27MM W/ADH WHITE

SOT-23

TI900-105-27-0.12-1A Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Material Silicone
Shape Rectangular
Series Ti900
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Conductive Insulator Pad
Color White
Shelf Life 12 Months
Adhesive Adhesive - One Side
Backing, Carrier Viscose
Outline 105.00mm x 27.00mm
Thermal Conductivity1.8W/m-K
Thickness 0.0050 0.127mm
RoHS StatusRoHS Compliant
In-Stock:1225 items

About TI900-105-27-0.12-1A

The TI900-105-27-0.12-1A from t-Global Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 105MMX27MM W/ADH WHITE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TI900-105-27-0.12-1A, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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