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ECC13DKSI

ECC13DKSI

ECC13DKSI

Sullins Connector Solutions

ECC13DKSI datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available on our website

SOT-23

ECC13DKSI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Material - Insulation Polybutylene Terephthalate (PBT)
Operating Temperature-65°C~125°C
PackagingTray
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type CARD EDGE CONNECTOR
Number of Positions 26
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Cantilever
Pitch 0.100 2.54mm
Total Number of Contacts 26
Number of Conductors ONE
Reference Standard UL
Contact Finish Gold
Reliability COMMERCIAL
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Breadth 0.37 inch
Body Depth 0.61 inch
Rated Current (Signal) 3A
Card Type Non Specified - Dual Edge
Read OutDual
Number of Positions/Bay/Row 13
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Mating Contact Row Spacing 0.1 inch
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μin
Card Thickness 0.062 1.57mm
Length - Termination 0.19 inch
RoHS StatusROHS3 Compliant
In-Stock:1629 items

Pricing & Ordering

QuantityUnit PriceExt. Price
10$4.85800$48.58

ECC13DKSI Product Details

ECC13DKSI Overview


Packaging was done to Tray's specifications.There is a recommendation for mounting type Through Hole.Using the connector socket CARD EDGE CONNECTOR is the device's method of connection.

ECC13DKSI Features



ECC13DKSI Applications


There are a lot of Sullins Connector Solutions ECC13DKSI Edgeboard Connectors applications.

  • Uninterrupted Power Supplies
  • High Speed Data Acquisition for PCs
  • Scientific instruments.
  • Communication test equipment
  • CMOS Image sensors for mobile applications
  • Audio/Video devices
  • Wireless local loop
  • Wireless and wired broadband communications
  • RADAR processing, digital oscilloscopes
  • Multiplexed Data Acquisition Systems

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