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ASM36DRAI

ASM36DRAI

ASM36DRAI

Sullins Connector Solutions

ASM36DRAI datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Sullins Connector Solutions stock available on our website

SOT-23

ASM36DRAI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBeryllium Copper
Mount Through Hole
Mounting Type Through Hole, Right Angle
Material - Insulation Polyphenylene Sulfide (PPS)
Operating Temperature-65°C~150°C
PackagingTray
Published 2008
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Full Bellows
Number of Positions 72
Color Green
Number of Rows 2
Gender Female
Subcategory Headers and Edge Type Connectors
Contact Type Full Bellows
Pitch 0.156 3.96mm
Total Number of Contacts 72
Number of Conductors ONE
Reference Standard UL, CSA
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 6.555 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Depth 0.431 inch
Rated Current (Signal) 3A
Contact Resistance 30mOhm
Card Type Non Specified - Dual Edge
Read OutDual
Insulation Resistance5000000000Ohm
Number of Positions/Bay/Row 36
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Body/Shell Style RECEPTACLE
Dielectric Withstanding Voltage 1800VDC V
Withdrawl Force-Min .139 N
Mating Contact Row Spacing 0.156 inch
Contact Finish Thickness 10.0μin 0.25μm
Plating Thickness 10μin
Card Thickness 0.062 1.57mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:322 items

Pricing & Ordering

QuantityUnit PriceExt. Price
10$25.97200$259.72

ASM36DRAI Product Details

ASM36DRAI Overview


The material was packaged in accordance with Tray's specifications.It's recommended to mount type Through Hole, Right Angle.Connecting the device uses the connector socket Full Bellows.

ASM36DRAI Features



ASM36DRAI Applications


There are a lot of Sullins Connector Solutions ASM36DRAI Edgeboard Connectors applications.

  • Multiplexed Data Acquisition Systems
  • Imaging Systems
  • Instrumentation and test equipment
  • Battery Operated Systems
  • Telecommunications
  • Medical Imaging
  • 3-phase power control
  • RADAR processing, digital oscilloscopes
  • In-building wireless telephony
  • Transducer

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