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STM32F756ZG

STM32F756ZG

STM32F756ZG

STMicroelectronics

Microcontroller 3V

SOT-23

STM32F756ZG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 7 months ago)
Surface MountYES
Number of Terminations 144
ECCN Code 5A992.C
HTS Code8542.31.00.01
Technology CMOS
Terminal Position QUAD
Terminal FormGULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.8V
Number of I/O 114
Speed 216 MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Clock Frequency 26MHz
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
Address Bus Width26
External Data Bus Width 32
Length 20mm
Width 20mm
RoHS StatusNon-RoHS Compliant
In-Stock:2474 items

STM32F756ZG Product Details

STM32F756ZG Description

The STM32F756xx devices are based on the high-performance ARM? Cortex?-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex?-M7 core features a single floating point unit (SFPU) precision which supports all ARM? single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.

The STM32F756xx devices incorporate high-speed embedded memories with a Flash memory of up to 1 Mbyte, 320 Kbytes of SRAM (including 64 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi ab bus matrix, and a multi-layer AXI interconnects supporting internal and external memories access.



STM32F756ZG Features

Core: ARM? 32-bit Cortex?-M7 CPU with FPU,

adaptive real-time accelerator (ART

Accelerator?) and L1-cache: 4KB data cache

and 4KB instruction cache, allowing 0-wait

state execution from embedded Flash memory

and external memories, frequency up to

216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz

(Dhrystone 2.1), and DSP instructions.

Memories

– Up to 1MB of Flash memory

– 1024 bytes of OTP memory

– SRAM: 320KB (including 64KB of data TCM RAM for critical real-time data) +

16KB of instruction TCM RAM (for critical

real-time routines) + 4KB of backup SRAM

(available in the lowest power modes)

– Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM,

SDRAM/LPSDR SDRAM, NOR/NAND

memories

Dual mode Quad-SPI

LCD parallel interface, 8080/6800 modes

LCD-TFT controller up to XGA resolution with

dedicated Chrom-ART Accelerator? for

enhanced graphic content creation (DMA2D)

Clock, reset and supply management

– 1.7 V to 3.6 V application supply and I/Os

– POR, PDR, PVD and BOR

– Dedicated USB power

– 4-to-26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC (1% accuracy)

– 32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

Low-power

– Sleep, Stop and Standby modes

– VBAT supply for RTC, 32×32 bit backup

registers + 4KB backup SRAM

3×12-bit, 2.4 MSPS ADC: up to 24 channels

and 7.2 MSPS in triple interleaved mode

2×12-bit D/A converters

Up to 18 timers: up to thirteen 16-bit (1x low-power 16-bit timer available in Stop mode) and

two 32-bit timers, each with up to 4

IC/OC/PWM or pulse counter and quadrature

(incremental) encoder input. All 15 timers

run up to 216 MHz. 2x watchdogs, SysTick

timer



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