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STL9P2UH7

STL9P2UH7

STL9P2UH7

STMicroelectronics

MOSFET POWER MOSFET

SOT-23

STL9P2UH7 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerVDFN
Number of Pins 8
Operating Temperature150°C TJ
PackagingCut Tape (CT)
Series STripFET™
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Resistance 19.5mOhm
Technology MOSFET (Metal Oxide)
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number STL9
Power Dissipation-Max 2.9W Tc
Turn On Delay Time12.5 ns
FET Type P-Channel
Rds On (Max) @ Id, Vgs 22.5m Ω @ 4.5A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 2390pF @ 16V
Current - Continuous Drain (Id) @ 25°C 9A Tc
Gate Charge (Qg) (Max) @ Vgs 22nC @ 4.5V
Rise Time30.5ns
Drive Voltage (Max Rds On,Min Rds On) 1.5V 4.5V
Vgs (Max) ±8V
Fall Time (Typ) 84.5 ns
Turn-Off Delay Time 128 ns
Continuous Drain Current (ID) 9A
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 20V
RoHS StatusROHS3 Compliant
In-Stock:1815 items

Pricing & Ordering

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About STL9P2UH7

The STL9P2UH7 from STMicroelectronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features MOSFET POWER MOSFET.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the STL9P2UH7, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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