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STFW3N150

STFW3N150

STFW3N150

STMicroelectronics

STFW3N150 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website

SOT-23

STFW3N150 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Lifecycle Status ACTIVE (Last Updated: 7 months ago)
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Package / Case ISOWATT218FX
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature150°C TJ
PackagingTube
Series PowerMESH™
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Resistance 9Ohm
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Base Part Number STFW
Pin Count3
Number of Elements 1
Power Dissipation-Max 63W Tc
Element ConfigurationSingle
Operating ModeENHANCEMENT MODE
Power Dissipation63W
Case Connection ISOLATED
Turn On Delay Time24 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 9 Ω @ 1.3A, 10V
Vgs(th) (Max) @ Id 5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 939pF @ 25V
Current - Continuous Drain (Id) @ 25°C 2.5A Tc
Gate Charge (Qg) (Max) @ Vgs 29.3nC @ 10V
Rise Time47ns
Drain to Source Voltage (Vdss) 1500V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±30V
Fall Time (Typ) 61 ns
Turn-Off Delay Time 45 ns
Continuous Drain Current (ID) 2.5A
Threshold Voltage 4V
Gate to Source Voltage (Vgs) 30V
Drain to Source Breakdown Voltage 1.5kV
Avalanche Energy Rating (Eas) 450 mJ
Height 26.7mm
Length 15.7mm
Width 5.7mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:1425 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.264600$3.2646
10$3.079811$30.79811
100$2.905482$290.5482
500$2.741021$1370.5105
1000$2.585869$2585.869

STFW3N150 Product Details

STFW3N150 Description


STFW3N150 is a type of PowerMESH power MOSFET developed by STMicroelectronics. It is designed utilizing the STMicroelectronics consolidated strip-layout-based MESH OVERLAY process. It can be found in the TO-3PF, H2PAK-2, TO-220, or TO247 packages with the purpose of saving board space. Based on its 100% avalanche tested, intrinsic capacitances and Qg minimized, and high-speed switching, STFW3N150 power MOSFET is well suited for various applications.



STFW3N150 Features


  • 100% avalanche tested

  • Intrinsic capacitances and Qg minimized

  • High-speed switching

  • Fully isolated TO-3PF plastic package, creepage distance path is 5.4 mm (typ.)



STFW3N150 Applications


  • Switching applications


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