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BULD741-1

BULD741-1

BULD741-1

STMicroelectronics

TRANS NPN 400V 2.5A IPAK

SOT-23

BULD741-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-251-3 Short Leads, IPak, TO-251AA
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature150°C TJ
PackagingTube
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
Terminal Finish MATTE TIN
Subcategory Other Transistors
Max Power Dissipation30W
Peak Reflow Temperature (Cel) 225
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BULD741
Pin Count3
Qualification StatusNot Qualified
Number of Elements 1
Element ConfigurationSingle
Power - Max 30W
Transistor Application SWITCHING
Polarity/Channel Type NPN
Transistor Type NPN
Collector Emitter Voltage (VCEO) 400V
Max Collector Current 2.5A
DC Current Gain (hFE) (Min) @ Ic, Vce 25 @ 450mA 3V
Current - Collector Cutoff (Max) 250μA
Vce Saturation (Max) @ Ib, Ic 1.5V @ 600mA, 2A
Collector Emitter Breakdown Voltage400V
Emitter Base Voltage (VEBO) 15V
hFE Min 48
RoHS StatusROHS3 Compliant
In-Stock:2250 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About BULD741-1

The BULD741-1 from STMicroelectronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features TRANS NPN 400V 2.5A IPAK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BULD741-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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