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BALF-SPI-01D3

BALF-SPI-01D3

BALF-SPI-01D3

STMicroelectronics

BALF-SPI-01D3 datasheet pdf and Balun product details from STMicroelectronics stock available on our website

SOT-23

BALF-SPI-01D3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Lifecycle Status ACTIVE (Last Updated: 8 months ago)
Contact PlatingCopper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-UFBGA, FCBGA
Number of Pins 6
PackagingCut Tape (CT)
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Max Operating Temperature150°C
Min Operating Temperature -40°C
Frequency 868MHz
Impedance50Ohm
Bandwidth 868MHz
Frequency Range779MHz~956MHz
Insertion Loss (dB) -23 dB
Transformer TypeRF TRANSFORMER
Insertion Loss (Max) 2.0dB
Return Loss-Min 23dB
Impedance - Unbalanced/Balanced 50 / -Ohm
Phase Difference10°
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:8467 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About BALF-SPI-01D3

The BALF-SPI-01D3 from STMicroelectronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features BALF-SPI-01D3 datasheet pdf and Balun product details from STMicroelectronics stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BALF-SPI-01D3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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