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RVC2010FT2M20

RVC2010FT2M20

RVC2010FT2M20

Stackpole Electronics Inc

FIXED RESISTOR SURFACE MOUNT, RVC Series, Thick Film, 2.2MOhm, 0.5W 1/2W, ±1%, -55°C~155°C

SOT-23

RVC2010FT2M20 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Package / Case 2010 (5025 Metric)
Surface MountYES
Terminal Shape WRAP AROUND
Mounting FeatureSURFACE MOUNT
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Series RVC
Size / Dimension 0.197Lx0.098W 5.00mmx2.50mm
Tolerance ±1%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±200ppm/°C
Resistance 2.2MOhm
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Composition Thick Film
Power (Watts) 0.5W 1/2W
Packing Method TR, EMBOSSED PLASTIC, 7 INCH
Construction Rectangular
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.5W
Height Seated (Max) 0.026 0.65mm
RoHS StatusROHS3 Compliant
In-Stock:38974 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About RVC2010FT2M20

The RVC2010FT2M20 from Stackpole Electronics Inc is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED RESISTOR SURFACE MOUNT, RVC Series, Thick Film, 2.2MOhm, 0.5W 1/2W, ±1%, -55°C~155°C.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RVC2010FT2M20, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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