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RPC2010MT22R0

RPC2010MT22R0

RPC2010MT22R0

Stackpole Electronics Inc

Res Thick Film 2010 22 Ohm 20% 3/4W 100ppm/C Molded SMD SMD Paper T/R

SOT-23

RPC2010MT22R0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingTin
Mount Surface Mount
Package / Case 2010 (5025 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Series RPC
Size / Dimension 0.197Lx0.098W 5.00mmx2.50mm
Tolerance ±20%
JESD-609 Code e3
Feature Automotive AEC-Q200, Pulse Withstanding
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±100ppm/°C
Resistance 22Ohm
Composition Thick Film
Power (Watts) 0.75W 3/4W
Packing Method TR, Embossed Plastic, 7 Inch
Construction Rectangular
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.75W
Working Voltage 400V
Height Seated (Max) 0.026 0.65mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:73769 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About RPC2010MT22R0

The RPC2010MT22R0 from Stackpole Electronics Inc is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thick Film 2010 22 Ohm 20% 3/4W 100ppm/C Molded SMD SMD Paper T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RPC2010MT22R0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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