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RNCS0402DTE5K11

RNCS0402DTE5K11

RNCS0402DTE5K11

Stackpole Electronics Inc

Res Thin Film 0402 5.11K Ohm 0.5% 1/16W 25ppm/C Molded SMD SMD T/R

SOT-23

RNCS0402DTE5K11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingTin
Mount Surface Mount
Package / Case 0402 (1005 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2010
Series RNCS
Size / Dimension 0.039Lx0.020W 1.00mmx0.50mm
Tolerance ±0.5%
JESD-609 Code e3
Feature Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±25ppm/°C
Resistance 5.11kOhm
Composition Thin Film
Power (Watts) 0.063W 1/16W
Additional FeaturePRECISION
Packing Method TR, PAPER, 7 INCH
Construction Rectangular
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.063W
Height Seated (Max) 0.014 0.35mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:42150 items

Pricing & Ordering

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About RNCS0402DTE5K11

The RNCS0402DTE5K11 from Stackpole Electronics Inc is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thin Film 0402 5.11K Ohm 0.5% 1/16W 25ppm/C Molded SMD SMD T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RNCS0402DTE5K11, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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