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RNCP1206FTD49R9

RNCP1206FTD49R9

RNCP1206FTD49R9

Stackpole Electronics Inc

RES SMD 49.9 OHM 1% 1/2W 1206

SOT-23

RNCP1206FTD49R9 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Contact PlatingTin
Mount Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2010
Series RNCP
Size / Dimension 0.122Lx0.059W 3.10mmx1.50mm
Tolerance ±1%
JESD-609 Code e3
Feature Anti-Sulfur, Moisture Resistant
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±100ppm/°C
Resistance 49.9Ohm
Composition Thin Film
Power (Watts) 0.5W 1/2W
Power Rating 500mW
Packing Method TR, Paper, 7 Inch
Max Power Dissipation500mW
Construction RECTANGULAR PACKAGE
Resistor Type FIXED RESISTOR
Case Code (Metric) 3216
Rated Power Dissipation (P) 0.5W
Case Code (Imperial) 1206
Height 609.6μm
Height Seated (Max) 0.024 0.60mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:80406 items

Pricing & Ordering

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About RNCP1206FTD49R9

The RNCP1206FTD49R9 from Stackpole Electronics Inc is a high-performance microcontroller designed for a wide range of embedded applications. This component features RES SMD 49.9 OHM 1% 1/2W 1206.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RNCP1206FTD49R9, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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