SI32266-C-GM1 Overview
A QFN package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A Surface Mount-axis mounts telecom switching.DIGITAL SLIC is the type of IC it uses for telecom.This part can perform many functions similar to the electronic parts under the ProSLIC? series.
SI32266-C-GM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32266-C-GM1 Applications
There are a lot of Silicon Labs SI32266-C-GM1 Telecom applications.
- T1/E1/J1 Multiplexer and Channel Banks
- Multi-Line E1 Interface Cards
- Codec function on telephone switch line cards
- ATM Switches
- Channel Service Units (CSUs): T1/E1/J1
- Integrated Multi-Service Access Platforms (IMAPs)
- Digital cross connects (DSX-1)
- Stations
- DECT (Digital European Cordless Telephone) Base
- E1 Multiplexer
