Name: PC-16-75
Brand: Signal Transformer
SKU: PC-16-75
Price: 6.55000 USD
Availability: InStock

new-10%

PC-16-75

Manufacturer part number:PC-16-75

Manufacturer:Signal Transformer

Description:XFRMR LAMINATED 1.2VA THRU HOLE

Case Package:SOT-23

Datasheet:PC-16-75 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	18 Weeks
Mount	Through Hole
Mounting Type	Through Hole
Weight	0.188lb 85.28g
Published	1997
Series	PC
Size / Dimension	34.90mm Lx28.60mm W
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	PC Pin
ECCN Code	EAR99
Type	Laminated Core
HTS Code	8504.31.40.35
Max Power Dissipation	1.2W
Frequency	500Hz
Termination Style	PC Pin
Approval Agency	UL; CSA
Number of Contacts	6
Voltage - Isolation	1500Vrms
Max Output Current	75mA
Current - Output (Max)	Parallel 150mA Series 75mA
Output Power	1.2W
Power - Max	1.2VA
Output Voltage 1	8V
Voltage - Primary	115V
Primary Winding(s)	Single
Center Tap	No
Voltage - Secondary (Full Load)	Parallel 8V Series 16V
Output Voltage 2	8V
Secondary Winding(s)	Dual
VA Rating	1.2 VA
Height	30.1mm
Height Seated (Max)	30.15mm
Length	34.9mm
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

About PC-16-75

The PC-16-75 from Signal Transformer is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 1.2VA THRU HOLE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the PC-16-75, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.