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MPC-X-12

MPC-X-12

MPC-X-12

Signal Transformer

XFRMR LAMINATED 10VA THRU HOLE

SOT-23

MPC-X-12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Weight 0.56lb 254.01g
Published 2009
Series MPC
Size / Dimension 47.60mm Lx36.50mm W
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination PC Pin
ECCN Code EAR99
Type Laminated Core
Additional FeaturePCB MOUNTABLE; OTHER SECONDARY IS WITH CENTER TAP
HTS Code8504.31.40.35
Max Power Dissipation10W
Reach Compliance Code unknown
Termination Style PC Pin
Approval Agency UL; CSA
Physical Dimension 47.6mm X 36.5mm X 41.3mm
Voltage - Isolation 1500Vrms
Max Output Current60mA
Current - Output (Max) Parallel 360mA Series 60mA
Power - Max 10VA
Voltage - Primary 115V
Primary Winding(s) Single
Center TapYes
Voltage - Secondary (Full Load) Parallel 5V Series 12V
Secondary Winding(s) Dual
VA Rating 10 VA
Height 41.3mm
Height Seated (Max) 41.70mm
Length 47.6mm
Width 36.5mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:614 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$8.13960$406.98

About MPC-X-12

The MPC-X-12 from Signal Transformer is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 10VA THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MPC-X-12, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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