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30-200-LPI

30-200-LPI

30-200-LPI

Signal Transformer

XFRMR SEMI-TORO 6VA THRU HOLE

SOT-23

30-200-LPI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Through Hole
Mounting Type Through Hole
Weight 0.39lb 176.9g
Published 2009
Series LPI
Size / Dimension 60.20mm Lx42.10mm W
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination PC Pin
ECCN Code EAR99
Type Semi-Toroidal
Additional FeaturePCB MOUNTABLE
Max Power Dissipation6W
Frequency 60Hz
Termination Style PC Pin
Approval Agency UL; CSA; TUV
Number of Contacts 8
Physical Dimension 60.2mm X 42.1mm X 22.7mm
Voltage - Isolation 4000Vrms
Max Output Current200mA
Current - Output (Max) Parallel 400mA Series 200mA
Output Power6W
Power - Max 6VA
Output Voltage 1 15V
Voltage - Primary 115V 230V
Primary Winding(s) Dual
Center TapNo
Voltage - Secondary (Full Load) Parallel 15V Series 30V
Number of Secondary Winding 2
VA Rating 6 VA
Height 22.7mm
Height Seated (Max) 22.70mm
Length 60.2mm
Width 42.1mm
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:677 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$10.72340$536.17

About 30-200-LPI

The 30-200-LPI from Signal Transformer is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR SEMI-TORO 6VA THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 30-200-LPI, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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