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12.8-1

12.8-1

12.8-1

Signal Transformer

XFRMR LAMINATED 12.8VA CHAS MNT

SOT-23

12.8-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Chassis Mount
Mounting Type Chassis Mount
Weight 1.2lbs 544.3g
Size / Dimension 73.00mm Lx50.80mm W
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Type Laminated Core
Additional FeatureTHE TWO SECONDARIES HAVE CENTER TAPPED CONNECTIONS
Max Power Dissipation12.8W
Reach Compliance Code unknown
Termination Style Solder, Quick Connect
Physical Dimension 73mm X 50.8mm X 58.7mm
Voltage - Isolation 1500Vrms
Max Output Current1A
Current - Output (Max) Parallel 2A Series 1A
Power - Max 12.8VA
Output Voltage 1 6.4V
Voltage - Primary 105V 115V 125V
Primary Winding(s) Single, Multiple Taps
Center TapYes
Voltage - Secondary (Full Load) Parallel 6.4V Series 12.8V
Output Voltage 2 6.4V
Secondary Winding(s) Single, Multiple Taps
Primary Rating SINGLE 115V
Height Seated (Max) 58.70mm
Length 73mm
Width 50.8mm
RoHS StatusROHS3 Compliant
In-Stock:182 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$42.77000$42.77

About 12.8-1

The 12.8-1 from Signal Transformer is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 12.8VA CHAS MNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 12.8-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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