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B53TP25C

B53TP25C

B53TP25C

Sensata-Crydom

B53TP25C datasheet pdf and Solid State Relays product details from Sensata-Crydom stock available on our website

SOT-23

B53TP25C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Chassis Mount, Panel, Screw
Mounting Type Chassis Mount
Package / Case Module
Number of Pins 8
PackagingTube
Series 53TP
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Screw
Max Operating Temperature80°C
Min Operating Temperature -40°C
Depth 35.4mm
Current Rating25A
Termination Style Screw Terminal
Output Type AC, Zero Cross
Circuit 3PST-NO (3 Form A)
Voltage - Input 90V~140VAC
Throw Configuration 3PST
Turn On Delay Time20 ms
Max Output Voltage530V
Relay Type Relay
Voltage - Load 48V~530V
Max Input Current 16mA
Input Current 16mA
Load Current25A
Isolation Voltage4kV
Height 79.7mm
Length 101.3mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:62 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$194.47000$194.47
10$185.21100$1852.11
50$176.79000$8839.5

About B53TP25C

The B53TP25C from Sensata-Crydom is a high-performance microcontroller designed for a wide range of embedded applications. This component features B53TP25C datasheet pdf and Solid State Relays product details from Sensata-Crydom stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B53TP25C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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