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EG01CV1

EG01CV1

EG01CV1

Sanken

DIODE GEN PURP 1KV 500MA AXIAL

SOT-23

EG01CV1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Diode Element Material SILICON
PackagingTape & Box (TB)
Published 2011
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
HTS Code8541.10.00.70
Terminal FormWIRE
JESD-30 Code O-PALF-W2
Qualification StatusNot Qualified
Operating Temperature (Max) 150°C
Number of Elements 1
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 50μA @ 1000V
Voltage - Forward (Vf) (Max) @ If 3.3V @ 500mA
Case Connection ISOLATED
Operating Temperature - Junction -40°C~150°C
Output Current-Max 0.5A
Voltage - DC Reverse (Vr) (Max) 1000V
Max Reverse Voltage (DC) 1kV
Average Rectified Current500mA
Reverse Recovery Time 100 ns
RoHS StatusRoHS Compliant
In-Stock:32680 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.594710$2.59471
10$2.447840$24.4784
100$2.309283$230.9283
500$2.178569$1089.2845
1000$2.055254$2055.254

About EG01CV1

The EG01CV1 from Sanken is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE GEN PURP 1KV 500MA AXIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EG01CV1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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