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TSW-114-09-G-S-RA

TSW-114-09-G-S-RA

TSW-114-09-G-S-RA

Samtec Inc.

SAMTEC TSW-114-09-G-S-RA Board-To-Board Connector, Right Angle, TSW Series, 14 Contacts, Header, 2.54 mm, Through Hole

SOT-23

TSW-114-09-G-S-RA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Contact MaterialBronze
Contact PlatingGold
Mount Through Hole
Published 2005
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type BOARD CONNECTOR
Number of Rows 1
Gender Male
HTS Code8536.69.40.40
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 2.54mm
Lead Pitch 2.54mm
Number of Contacts 14
Mating Information MULTIPLE MATING PARTS AVAILABLE
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:2401 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.73000$2.73
500$2.7027$1351.35
1000$2.6754$2675.4
1500$2.6481$3972.15
2000$2.6208$5241.6
2500$2.5935$6483.75

About TSW-114-09-G-S-RA

The TSW-114-09-G-S-RA from Samtec Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features SAMTEC TSW-114-09-G-S-RA Board-To-Board Connector, Right Angle, TSW Series, 14 Contacts, Header, 2.54 mm, Through Hole.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TSW-114-09-G-S-RA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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