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TSM-104-01-F-SH-LC

TSM-104-01-F-SH-LC

TSM-104-01-F-SH-LC

Samtec Inc.

TSM Series 1-Row Header Solder Phosphor Bronze Tube Surface Mount, Right Angle Gold Liquid Crystal Polymer (LCP) 4-Position Board to Board or Cable 0.120 3.05mm Height

SOT-23

TSM-104-01-F-SH-LC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Surface Mount, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Series TSM
JESD-609 Code e3
Feature Board Lock
Part StatusActive
Termination Solder
Connector Type Header
Number of Positions 4
Number of Rows 1
Gender Male
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 4
Insulation Height 0.120 3.05mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Number of Conductors ONE
Reliability COMMERCIAL
Shrouding Unshrouded
Number Of PCB Rows 1
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Body Depth 0.28 inch
Contact Finish Thickness - Mating 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:3903 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.24000$1.24

TSM-104-01-F-SH-LC Product Details

TSM-104-01-F-SH-LC Overview


This product is packaged in a Header box.Surface Mount, Right Angle indicates that the device is mounted.An Tube case is utilized for packaging the product.The product is a part of the TSM Series.In many ways, Board Lock makes it more powerful.Operating temperature is set to -55°C~125°C.

TSM-104-01-F-SH-LC Features


TSM series


TSM-104-01-F-SH-LC Applications


There are a lot of Samtec Inc.
TSM-104-01-F-SH-LC Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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