Name: TLW-119-05-G-D
Brand: Samtec Inc.
SKU: TLW-119-05-G-D
Price: 6.82000 USD
Availability: InStock

new-10%

TLW-119-05-G-D

Manufacturer part number:TLW-119-05-G-D

Manufacturer:Samtec Inc.

Description:Flex Stack, TLW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 38-Position Board to Board or Cable 0.060 1.52mm Height

Case Package:SOT-23

Datasheet:TLW-119-05-G-D Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Housing Material	Plastic
Operating Temperature	-55°C~125°C
Packaging	Bulk
Published	2006
Series	Flex Stack, TLW
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Connector Type	Header
Number of Positions	38
Number of Rows	2
Gender	Male
Additional Feature	LOW PROFILE
HTS Code	8536.69.40.40
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	5.2A per Contact
Insulation Height	0.060 1.52mm
Style	Board to Board or Cable
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Number of Conductors	ONE
Reliability	COMMERCIAL
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.170 4.32mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Contact Length - Mating	0.105 2.67mm
PCB Contact Pattern	RECTANGULAR
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Body Breadth	0.198 inch
Housing Color	Black
Body Depth	0.06 inch
Overall Contact Length	0.335 8.51mm
Mating Contact Pitch	0.1 inch
Height	1.52mm
Length	48.3mm
Width	5.03mm
Plating Thickness	10μin
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	Flash
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free

TLW-119-05-G-D Product Details

TLW-119-05-G-D Overview

A Header package is included with it.Its mounting type is Through Hole.Packaging is performed using a Bulk case.It is part of the Flex Stack, TLW Series of products.Additionally, there are other features, such as LOW PROFILE.Through Hole mounts the part.There is no operating temperature for the device.