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T1M-04-GF-DV

T1M-04-GF-DV

T1M-04-GF-DV

Samtec Inc.

T1M - Samtec Wire-to-Board 1mm Discrete Wire Terminal Strip

SOT-23

T1M-04-GF-DV Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~85°C
PackagingBulk
Series T1M
Part StatusActive
Termination Solder
ECCN Code EAR99
Connector Type Header
Number of Positions 8
Number of Rows 2
Voltage - Rated 250VAC 353VDC
Fastening TypeLocking Ramp
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 3.3A per Contact
Insulation Height 0.268 6.80mm
Style Board to Cable/Wire
Number of Positions Loaded All
Pitch - Mating 0.039 1.00mm
Insulation Color Natural
Row Spacing - Mating 0.077 (1.96mm)
Shrouding Shrouded - 4 Wall
Contact Finish Thickness - Mating 3.00μin 0.076μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:1052 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.98000$3.98

About T1M-04-GF-DV

The T1M-04-GF-DV from Samtec Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features T1M - Samtec Wire-to-Board 1mm Discrete Wire Terminal Strip.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T1M-04-GF-DV, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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