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HTSW-125-08-TM-D-RA

HTSW-125-08-TM-D-RA

HTSW-125-08-TM-D-RA

Samtec Inc.

HTSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole, Right Angle Tin Liquid Crystal Polymer (LCP) 50-Position Board to Board or Cable 0.240 6.10mm Height

SOT-23

HTSW-125-08-TM-D-RA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Housing Material Polymer
Operating Temperature-55°C~105°C
PackagingBulk
Series HTSW
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 50
Number of Rows 2
Gender Male
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Orientation Right Angle
Depth 12.44mm
Insulation Height 0.240 6.10mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Number of Conductors ONE
Reliability COMMERCIAL
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.090 2.29mm
Shrouding Unshrouded
Number Of PCB Rows 2
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Mating Contact Pitch 0.1 inch
Max Voltage Rating (AC) 450V
Max Current Rating 7.6A
Length 63.5mm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:1640 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.00000$3

HTSW-125-08-TM-D-RA Product Details

HTSW-125-08-TM-D-RA Overview


It comes in Header packaging.The device's mounting type is Through Hole, Right Angle.In order to package the product, a Bulk case is used.It belongs to the HTSW Series of products.The device runs in -55°C~105°C Operating Temperature.

HTSW-125-08-TM-D-RA Features


HTSW series


HTSW-125-08-TM-D-RA Applications


There are a lot of Samtec Inc.
HTSW-125-08-TM-D-RA Rectangular Connectors applications.


  • Industrial Automation
  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics

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