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HMTSW-102-08-L-D-230-LA

HMTSW-102-08-L-D-230-LA

HMTSW-102-08-L-D-230-LA

Samtec Inc.

Flex Stack, HMTSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 4-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

HMTSW-102-08-L-D-230-LA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingBulk
Series Flex Stack, HMTSW
Published 2016
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 4
Number of Rows 2
Fastening TypePush-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 3A
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.200 5.08mm
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
Overall Contact Length 0.530 13.46mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:4178 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.71000$0.71

HMTSW-102-08-L-D-230-LA Product Details

HMTSW-102-08-L-D-230-LA Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the Flex Stack, HMTSW Series.Devices operate at -55°C~125°C operating temperatures.

HMTSW-102-08-L-D-230-LA Features


Flex Stack, HMTSW series


HMTSW-102-08-L-D-230-LA Applications


There are a lot of Samtec Inc.
HMTSW-102-08-L-D-230-LA Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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