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FTSH-107-05-F-DV-P

FTSH-107-05-F-DV-P

FTSH-107-05-F-DV-P

Samtec Inc.

CONN HEADER SMD 14POS 1.27MM

SOT-23

FTSH-107-05-F-DV-P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialPhosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-55°C~125°C
PackagingTube
Series FTSH
Feature Pick and Place
Part StatusActive
Termination Solder
Connector Type Header, Cuttable
Number of Positions 14
Number of Rows 2
Fastening TypePush-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 3.4A per Contact
Insulation Height 0.099 2.51mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.050 1.27mm
Insulation Color Black
Row Spacing - Mating 0.050 (1.27mm)
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.170 4.32mm
Contact Finish Thickness - Mating 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2295 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.56000$2.56

About FTSH-107-05-F-DV-P

The FTSH-107-05-F-DV-P from Samtec Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER SMD 14POS 1.27MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FTSH-107-05-F-DV-P, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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