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BSE-040-01-C-D-A-TR

BSE-040-01-C-D-A-TR

BSE-040-01-C-D-A-TR

Samtec Inc.

Conn Micro Socket SKT 80 POS 0.8mm Solder ST SMD T/R

SOT-23

BSE-040-01-C-D-A-TR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBronze
Mounting Type Surface Mount
PackagingTape & Reel (TR)
Published 2015
Series BSE
JESD-609 Code e3
Feature Board Guide
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Center Strip Contacts
Number of Positions 80
Number of Rows 2
Gender Female
Additional FeatureE.L.P
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.031 0.80mm
Total Number of Contacts 80
Contact Finish Gold
Mating Information MULTIPLE MATING PARTS AVAILABLE
Body/Shell Style SOCKET
Contact Finish Thickness 50.0μin 1.27μm
Height Above Board 0.128 3.25mm
Stack Height (Mating) 5mm 8mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:943 items

Pricing & Ordering

QuantityUnit PriceExt. Price
125$7.08352$885.44

About BSE-040-01-C-D-A-TR

The BSE-040-01-C-D-A-TR from Samtec Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Micro Socket SKT 80 POS 0.8mm Solder ST SMD T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSE-040-01-C-D-A-TR, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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