Name: BBD-102-G-B
Brand: Samtec Inc.
SKU: BBD-102-G-B
Price: 3.10000 USD
Availability: InStock

new-10%

BBD-102-G-B

Manufacturer part number:BBD-102-G-B

Manufacturer:Samtec Inc.

Description:BBD Series 2-Row Header Solder Bronze Tube Through Hole Gold Polyester, Glass Filled 4-Position Board to Board 0.335 8.51mm Height

Case Package:SOT-23

Datasheet:BBD-102-G-B Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Bronze
Mount	Through Hole
Mounting Type	Through Hole
Contact Shape	Circular
Insulation Material	Polyester, Glass Filled
Operating Temperature	-55°C~125°C
Packaging	Tube
Series	BBD
Published	2014
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
ECCN Code	EAR99
Connector Type	Header
Number of Positions	4
Number of Rows	2
Gender	Male
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Insulation Height	0.335 8.51mm
Style	Board to Board
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Insulation Color	Black
Number of Conductors	ONE
Reference Standard	UL
Reliability	COMMERCIAL
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.125 3.18mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Contact Finish - Post	Nickel
Contact Length - Mating	0.125 3.18mm
PCB Contact Pattern	RECTANGULAR
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Overall Contact Length	0.585 14.86mm
Mating Contact Pitch	0.1 inch
Contact Finish Thickness - Mating	20.0μin 0.51μm
Contact Finish Thickness - Post	50.0μin 1.27μm
REACH SVHC	No SVHC
Radiation Hardening	No
RoHS Status	ROHS3 Compliant

BBD-102-G-B Product Details

BBD-102-G-B Overview

A Header package is included with it.Its mounting type is Through Hole.Packaging is performed using a Tube case.It is part of the BBD Series of products.Through Hole mounts the part.There is no operating temperature for the device.