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RC50UT25F1693CS

RC50UT25F1693CS

RC50UT25F1693CS

SAMSUNGSEMICONDUCTOR

RC50UT25F1693CS datasheet pdf and Buzzer Elements, Piezo Benders product details from SAMSUNGSEMICONDUCTOR stock available on our website

SOT-23

RC50UT25F1693CS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 5 Weeks
Mount Through Hole
Mounting Type Surface Mount
Package / Case TQFP
Number of Pins 8
Operating Temperature -
Packaging Bulk
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) -
Number of Terminations 8
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Operational Amplifier
Voltage - Supply 20V ~ 50V
Base Part Number Lay Ewcp
Output Voltage 46 V
Output Type Analog Voltage
Interface -
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current 1.5 mA
Output Current 80 mA
Max Supply Current 10 mA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4648 items

About RC50UT25F1693CS

The RC50UT25F1693CS from SAMSUNGSEMICONDUCTOR is a high-performance microcontroller designed for a wide range of embedded applications. This component features RC50UT25F1693CS datasheet pdf and Buzzer Elements, Piezo Benders product details from SAMSUNGSEMICONDUCTOR stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RC50UT25F1693CS, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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